CAMERA MODULE FOR HEAT DISSIPATION AND GROUNDING, AND ELECTRONIC DEVICE COMPRISING SAME

A camera module includes a printed circuit board having a conductive pad exposed on one surface, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator dis...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, Wonchul, CHOI, Kwangsic, KIM, Taeyun, CHO, Minki, AHN, Dohyun, JEONG, Wonjun, KIM, Jungsoo, HEO, Chonguk
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A camera module includes a printed circuit board having a conductive pad exposed on one surface, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.