UV LED CURABLE HOTMELT PRESSURE SENSITIVE ADHESIVE COMPOSITION

The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.

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Bibliographische Detailangaben
Hauptverfasser:	Roschkowski, Thomas, Taden, Andreas, Schneider, Anja, Arnold, Moritz
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.