SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICKNESS TRENDING IN PECVD DEPOSITION SYSTEM

A controller for a processing chamber configured to perform a deposition process on a substrate comprises a temperature monitor configured to obtain a temperature of a showerhead of the processing chamber, a deposition time determiner configured to determine an optimized deposition time based on the...

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Bibliographische Detailangaben
Hauptverfasser:	MULLENAUX, Sky, HONG, Tu, SHEN, Wenjia, KANG, Hu, KOLLRACK, Marc, WANG, Dong
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A controller for a processing chamber configured to perform a deposition process on a substrate comprises a temperature monitor configured to obtain a temperature of a showerhead of the processing chamber, a deposition time determiner configured to determine an optimized deposition time based on the obtained temperature of the showerhead and data that correlates the temperature of the showerhead with at least one of the optimized deposition time, a deposition thickness, and a deposition rate, and a deposition optimizer configured to perform a deposition step on the substrate based on the determined optimized deposition time.