METHOD OF FORMING AN INTERCONNECT FOR AN ELECTROCHEMICAL DEVICE STACK USING SPARK PLASMA SINTERING

A method of forming an interconnect for an electrochemical device stack includes loading a die with an interconnect material comprising an interconnect body powder comprising chromium and iron, and spark plasma sintering (SPS) the interconnect material to form a body of the interconnect.

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Bibliographische Detailangaben
Hauptverfasser: ASHARY, Adil, BYRD, Adam
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A method of forming an interconnect for an electrochemical device stack includes loading a die with an interconnect material comprising an interconnect body powder comprising chromium and iron, and spark plasma sintering (SPS) the interconnect material to form a body of the interconnect.