POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

A power semiconductor package comprises a leadframe comprising a first die pad, a second die pad and a plurality of external contacts, wherein the first and second die pads are separated by a first gap, a power semiconductor die arranged on and electrically coupled to a first side of the first die p...

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Bibliographische Detailangaben
Hauptverfasser:	SCHMOELZER, Bernd, SCHINDLER, Uwe, BOEHM, Marcus, WOETZEL, Stefan, GRASSMANN, Andreas
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power semiconductor package comprises a leadframe comprising a first die pad, a second die pad and a plurality of external contacts, wherein the first and second die pads are separated by a first gap, a power semiconductor die arranged on and electrically coupled to a first side of the first die pad, a diode arranged on and electrically coupled to a first side of the second die pad, and a molded body encapsulating the power semiconductor die and the diode, the molded body having a first side, an opposite second side and lateral sides connecting the first and second sides, wherein a second side of the first die pad opposite the first side of the first die pad is exposed from the second side of the molded body and wherein a second side of the second die pad opposite the first side of the second die pad is completely covered by an electrically insulating material.