SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by...

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Bibliographische Detailangaben
Hauptverfasser:	Rush, Brian Magann, Wetzel, Todd Garrett, Lassini, Stefano Angelo Mario, Gerstler, William Dwight
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.