HEATING BODY, ATOMIZATION ASSEMBLY, AND ELECTRONIC ATOMIZATION DEVICE

A heating body (11), an atomization assembly (1) and an electronic atomization device. The heating body (11) the pore sizecomprises a dense substrate (111) and a heating film (112). The dense substrate (111) includes a first surface (1111) and a second surface (1112) opposite to the first surface (1111). The dense substrate (111) is provided with a plurality of micropores (113) The micropores (113) are through holes, and the micropores are used for guiding an aerosol-generating substrate to the first surface (1111). The heating film (112) is formed on the first surface (1111). The ratio of the thickness of the dense substrate (111) to the pore size of the micropsore is i20: 1-3:1. By means of said arrangement, the porosity of the heating body (11) can be precisely controlled, thereby improving product consistency, and duiring the working process of the heating body (11), sufficient liquid supply is achieved and liquid leakage is prevented.