CIRCUIT BOARD AND ELECTRONIC DEVICE

To sufficiently reduce transmission loss and noise of a signal. A signal wire is located on a first surface of an insulation substrate, a first ground and a second ground are located on the first surface of the insulation substrate with the signal wire interposed therebetween, a via conductor electr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUGAI, Kouichirou, HIGUCHI, Shinya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To sufficiently reduce transmission loss and noise of a signal. A signal wire is located on a first surface of an insulation substrate, a first ground and a second ground are located on the first surface of the insulation substrate with the signal wire interposed therebetween, a via conductor electrically connecting the first ground and the lower ground is located at least one of on a second surface of the insulation substrate or inside the insulation substrate, and a side-surface metal layer electrically connecting the second ground and the lower ground is located on a third surface of the insulation substrate.