PLACING ULTRA-SMALL OR ULTRA-THIN DISCRETE COMPONENTS

PLACING ULTRA-SMALL OR ULTRA-THIN DISCRETE COMPONENTS

A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ATANASOV, Yuriy, MARINOV, Val
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.