GLASS-BASED CAVITY AND CHANNELS FOR COOLING OF EMBEDDED DIES AND 3D INTEGRATED MODULES USING PACKAGE SUBSTRATES WITH GLASS CORE

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the...

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Bibliographische Detailangaben

Hauptverfasser:	KAMGAING, Telesphor, PRABHU GAUNKAR, Neelam, ALEKSOV, Aleksandar, DOGIAMIS, Georgios C, STRONG, Veronica
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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