GLASS-BASED CAVITY AND CHANNELS FOR COOLING OF EMBEDDED DIES AND 3D INTEGRATED MODULES USING PACKAGE SUBSTRATES WITH GLASS CORE

GLASS-BASED CAVITY AND CHANNELS FOR COOLING OF EMBEDDED DIES AND 3D INTEGRATED MODULES USING PACKAGE SUBSTRATES WITH GLASS CORE

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the...

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Bibliographische Detailangaben
Hauptverfasser: KAMGAING, Telesphor, PRABHU GAUNKAR, Neelam, ALEKSOV, Aleksandar, DOGIAMIS, Georgios C, STRONG, Veronica
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.