MONITORING AND CONTROL OF A SEMICONDUCTOR MANUFACTURING PROCESS
Monitoring of a semiconductor manufacturing process. Wafer measurement data is obtained (301); Zernike polynomials are fitted (302) to the wafer measurement data to obtain representation of respective wafermap patterns; a knowledgebase of wafermap patterns is built (303) based on the respective coef...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Monitoring of a semiconductor manufacturing process. Wafer measurement data is obtained (301); Zernike polynomials are fitted (302) to the wafer measurement data to obtain representation of respective wafermap patterns; a knowledgebase of wafermap patterns is built (303) based on the respective coefficients of the Zernike polynomials; the wafermap patterns of the knowledgebase are grouped (304) to wafermap pattern groups based on the respective coefficients of the Zernike polynomials; and at least some of the wafermap pattern groups of the knowledgebase and the respective coefficients of the Zernike polynomials are used (305) for analyzing new wafer measurement data for the purpose of monitoring the semiconductor manufacturing process. |
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