CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME

CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME

A circuit board according to an embodiment includes: an insulating layer; and a circuit pattern layer disposed on the insulating layer and formed of an alloy, wherein the alloy includes: a first metal having a content in a range of 60 wt% to 80 wt%; a second metal having a content in a range of 10 w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, In Jae, JO, Min Sung
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A circuit board according to an embodiment includes: an insulating layer; and a circuit pattern layer disposed on the insulating layer and formed of an alloy, wherein the alloy includes: a first metal having a content in a range of 60 wt% to 80 wt%; a second metal having a content in a range of 10 wt% to 22 wt%; and a third metal having a content in a range of 3 wt% to 20 wt%; wherein the first metal includes any one of nickel (Ni) and iron (Fe), wherein the second metal includes chromium (Cr), and wherein the third metal includes a metal different from the first metal among nickel (Ni) and iron (Fe).