A PROCESS FOR WAFER BONDING

The present invention relates to a temporary wafer bonding process comprising the steps of: providing a wafer (1) for back processing by laminating a plain protective film (2) on a front surface (1a) of the wafer; providing a rigid carrier (3); bonding the rigid carrier to the plain protective film...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VISKER, Jakob, VANHAELEMEERSCH, Serge, PENG, Lan, DANG THI THUY, Chi, HUMBERT, Aurelie, VISKER, Evert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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