A PROCESS FOR WAFER BONDING

A PROCESS FOR WAFER BONDING

The present invention relates to a temporary wafer bonding process comprising the steps of: providing a wafer (1) for back processing by laminating a plain protective film (2) on a front surface (1a) of the wafer; providing a rigid carrier (3); bonding the rigid carrier to the plain protective film...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VISKER, Jakob, VANHAELEMEERSCH, Serge, PENG, Lan, DANG THI THUY, Chi, HUMBERT, Aurelie, VISKER, Evert
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention relates to a temporary wafer bonding process comprising the steps of: providing a wafer (1) for back processing by laminating a plain protective film (2) on a front surface (1a) of the wafer; providing a rigid carrier (3); bonding the rigid carrier to the plain protective film by the intermediate of a bonding material layer; processing a back surface (1b) of the wafer; and separating the rigid carrier and the plain protective film from the wafer.