WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING A SEMICONDUCTOR CIRCUIT

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING A SEMICONDUCTOR CIRCUIT

A layer stack (130) is formed that includes a device layer (110) and an insulator layer (120). The device layer (110) includes electronic elements (315). The insulator layer (120) is adjacent to a back surface (112) of the device layer (110). A spacer disk (190) is adhesive bonded on the layer stack...

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Hauptverfasser: DEBIE, Derek, BUSCH, Joerg, FISCHER, Thomas, SCHMIDT, Matthias, PORWOL, Daniel, GRUBER, Hermann
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator DEBIE, Derek
BUSCH, Joerg
FISCHER, Thomas
SCHMIDT, Matthias
PORWOL, Daniel
GRUBER, Hermann
description A layer stack (130) is formed that includes a device layer (110) and an insulator layer (120). The device layer (110) includes electronic elements (315). The insulator layer (120) is adjacent to a back surface (112) of the device layer (110). A spacer disk (190) is adhesive bonded on the layer stack (130) on a side opposite the device layer (110). The spacer disk (190) and the layer stack (130) form a wafer composite (100). The wafer composite (100) is divided into a plurality of individual semiconductor chips (900), wherein each semiconductor chip (900) includes a portion of the layer stack (130) and a portion of the spacer disk (190).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING A SEMICONDUCTOR CIRCUIT
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