A METHOD AND A SYSTEM FOR MANUFACTURING AN ASSEMBLY OF A POWER SEMICONDUCTOR

A METHOD AND A SYSTEM FOR MANUFACTURING AN ASSEMBLY OF A POWER SEMICONDUCTOR

The present invention concerns a method for manufacturing a package of a power semiconductor and a package comprising a power semiconductor (200). The package comprises:- conducting layers (240a,240b, 240c) over each electrode (250a,250b,250c) of the power semiconductor,- nanowires (500a, 500b, 500c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MORAND, Julien
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention concerns a method for manufacturing a package of a power semiconductor and a package comprising a power semiconductor (200). The package comprises:- conducting layers (240a,240b, 240c) over each electrode (250a,250b,250c) of the power semiconductor,- nanowires (500a, 500b, 500c) over the part of the conducting layer that are over the electrodes,- cured prepeg (700a, 700b) on each side of the power semiconductor and over (910b) a part of a masking film that separate two electrodes,- conducting layers (110a, 110b)) over nanowires, the conducting layers over each electrode of the power semiconductor, the nanowires and the conducting layers over the nanowires forming a single conductor unit.