PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

Embodiments of this application provide a printed circuit board, including a core board and a substrate. The core board covers and is disposed on an outer surface of the substrate. The core board includes a first conductive layer, a second conductive layer, and a first dielectric layer. The first conductive layer is located on a side that is of the core board and that is away from the substrate, the second conductive layer is located on a side that is of the core board and that is close to the substrate, and the first dielectric layer is located between the first conductive layer and the second conductive layer, and includes a flexible dielectric layer whose Young's modulus is less than or equal to a preset Young's modulus. In the printed circuit board provided in embodiments of this application, a modulus of a PCB at the bottom of a solder joint of a power device is reduced, so that reliability of the solder joint between the power device and the PCB is improved and a service life requirement of a product is met. In addition, a voltage withstanding capability between an outermost conductive layer and a secondary outer conductive layer is enhanced.