WAFER FOR FOODSTUFF PRODUCTS

Described herein is a wafer (10) for foodstuff products characterized in that it comprises granular material (14) integrated in its structure and projecting from a surface (12) thereof.

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Bibliographische Detailangaben
1. Verfasser: RATTO, Gabriele
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Described herein is a wafer (10) for foodstuff products characterized in that it comprises granular material (14) integrated in its structure and projecting from a surface (12) thereof.