WAFER FOR FOODSTUFF PRODUCTS
Described herein is a wafer (10) for foodstuff products characterized in that it comprises granular material (14) integrated in its structure and projecting from a surface (12) thereof.
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Described herein is a wafer (10) for foodstuff products characterized in that it comprises granular material (14) integrated in its structure and projecting from a surface (12) thereof. |
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