PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

There is provided a printed wiring board 101 including an outermost conductive layer that includes a plurality of conductive pads 40, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMAMOTO, Keisuke, UEMATSU, Yutaka, ONOE, Shinsuke, OSHIMA, Yohei, HAMAMOTO, Goro
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:There is provided a printed wiring board 101 including an outermost conductive layer that includes a plurality of conductive pads 40, a first conductive layer that includes a first inner-layer wiring and is stacked on the conductive layer, a second conductive layer that includes a second inner-layer wiring and is stacked on the conductive layer and the first conductive layer, a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other, a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other, and a stitching via 60 that is connected to a ground. The first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads 40 are arranged.