SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

A semiconductor package (1) includes: a redistribution layer (100) including a plurality of conductive lines (126), a plurality of conductive vias (128) each connected to at least one of the plurality of conductive lines (126), and a plurality of lower pads (122) each connected to one of the plurality of conductive vias (128); a semiconductor chip (10) on the redistribution layer (100); and a plurality of external connection terminals (150) attached to the plurality of lower pads (122); and a plurality of electrical paths, wherein each of the plurality of electrical paths includes at least one of the plurality of conductive lines (126) and at least one of the plurality of conductive vias (128). The plurality of electrical paths is configured for testing the plurality of conductive lines and the plurality of conductive vias (128) and is connected to at least four of the external connection test terminals (152, 154).