CHIP, METHOD FOR MANUFACTURING CHIP, AND ADHESIVE COMPOSITION

The chip, which has excellent blocking resistance and dissolves in an organic solvent in a short time, is provided. By the chip also an adhesive composition with excellent brushability and layer separation resistance and little coloration can be obtained. A method for producing the chip, and an adhe...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAGAI, Yushi, NAGAOKA, Kota
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The chip, which has excellent blocking resistance and dissolves in an organic solvent in a short time, is provided. By the chip also an adhesive composition with excellent brushability and layer separation resistance and little coloration can be obtained. A method for producing the chip, and an adhesive composition that has excellent brushability and layer separation resistance, and little coloring. are also provided.According to the present invention, a chip for an adhesive composition, comprising a chloroprene-based polymer rubber, wherein: a temperature near a center of the chip 60 seconds after the chip heated to 140°C is kept in a room at 23°C is less than 130°C; time required for Ax to exceed A0 + 20 is less than 500 minutes; A0 is a Type A durometer hardness measured in accordance with JIS K 6253-3 of a 6 mm thickness sheet, prepared by press molding the chip at 70°C, taken out from a mold and allowed to stand for 1 hour in a 23°C environment; AX is a Type A durometer hardness after X minutes of placing the 6 mm thick sheet in a thermostatic chamber at -10°C, is provided.