CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

According to an embodiment of the disclosure, an electronic device may include a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electrical component, a power management integrated circuit(PMIC), and a capacitor. The first printed circuit board or the s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, Younghoon, KIM, Juntae, JANG, Jisang
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:According to an embodiment of the disclosure, an electronic device may include a housing, a first printed circuit board, a second printed circuit board, an interposer, a first electrical component, a power management integrated circuit(PMIC), and a capacitor. The first printed circuit board or the second printed circuit board may be disposed in the housing. The interposer may be disposed along at least a portion of an edge of the first printed circuit board or at least a portion of an edge of the second printed circuit board. The first electrical component may be disposed on the first printed circuit board. The PMIC may be disposed on the second printed circuit board. The capacitor may interconnect the first printed circuit board and the second printed circuit board. The capacitor may be coupled to the first printed circuit board and the second printed circuit board. The capacitor may be disposed adjacent to the PMIC. The capacitor may be configured to supply power that is supplied from the PMIC, to the first electrical component. The capacitor may include at least two electrodes disposed to be spaced apart from each other and in parallel to each other.