SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND PRODUCING METHOD THEREOF

The present disclosure relates to a semiconductor device, a communication apparatus and a producing method thereof. The semiconductor device includes: a first functional module arranged on a first substrate (100y) and comprising a chip (101), an electrical connection component and a sealing ring (102), where the sealing ring (102) surrounds the chip (101), and the chip (101) is electrically connected to the electrical connection component; a second functional module comprising a packaging substrate (200), where the packaging substrate comprises at least two metal layers and a dielectrical layer between the metal layers; a third functional module comprising multiple redistribution lines (302; 3021,3022,3024,3025) and multiple micro through holes (303; 3031,3032,3033) used for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate (400), where the second substrate (400) is sealed with the first substrate (100). At least two of the multiple redistribution lines intersect with each other, and at least one of the micro through holes is electrically connected to the second functional module through at least two different redistribution lines.