DEPOSITION APPARATUS

A deposition apparatus according to an embodiment includes a deposition source, and a deposition portion that faces the deposition source. The deposition portion is disposed at an angle of about 4 degrees to about 14 degrees with respect to an imaginary vertical line that is perpendicular to ground....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JIN, Seung Min, CHO, Youngsun, HONG, Jae Min, KO, Junhyeuk, KIM, Myungkyu, LEE, Young Kwang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus according to an embodiment includes a deposition source, and a deposition portion that faces the deposition source. The deposition portion is disposed at an angle of about 4 degrees to about 14 degrees with respect to an imaginary vertical line that is perpendicular to ground. The deposition portion includes a frame including an opening, and an outer portion disposed around the opening, a substrate disposed on a first side of the frame, and a plurality of back stages disposed on a second side opposite to the first side of the frame. The frame moves by movement of the plurality of back stages.