LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
A liquid ejecting head (1) includes a piezoelectric member, electrodes, and a wiring substrate (73). The piezoelectric member has a plurality of piezoelectric elements formed of a piezoelectric material. The electrodes are formed on the piezoelectric member. The wiring substrate is joined to the ele...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A liquid ejecting head (1) includes a piezoelectric member, electrodes, and a wiring substrate (73). The piezoelectric member has a plurality of piezoelectric elements formed of a piezoelectric material. The electrodes are formed on the piezoelectric member. The wiring substrate is joined to the electrodes by solder. The solder has a melting point of less than or equal to 1/2 of the Curie point of the piezoelectric material. |
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