CIRCUIT BOARD
The invention relates to a circuit board (1) comprising a first outer layer (3) which has at least one semiconductor component (7) with at least one power semiconductor; a second outer layer (4) which has at least one metal cooling element (12) paired with the power semiconductor; at least one inner...
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Hauptverfasser: | , , , , , |
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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