CIRCUIT BOARD

The invention relates to a circuit board (1) comprising a first outer layer (3) which has at least one semiconductor component (7) with at least one power semiconductor; a second outer layer (4) which has at least one metal cooling element (12) paired with the power semiconductor; at least one inner...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	POCHERT, Peter, KRALICEK, Peter, BUHMANN-BRAUN, Mitja, HUEBL, Jochen, KEICHER, Michael, HEINZ, Jochen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a circuit board (1) comprising a first outer layer (3) which has at least one semiconductor component (7) with at least one power semiconductor; a second outer layer (4) which has at least one metal cooling element (12) paired with the power semiconductor; at least one inner layer (5) which is arranged axially between the outer layers (3, 4) with respect to an axis (2) oriented perpendicularly to the layers (3, 4, 5), wherein a respective layer (6) made of an electrically insulating material is arranged between two adjacent layers (3, 4, 5); and at least one metal heat exchanger (14) which extends through the circuit board (1) at least in the axial direction such that the power semiconductor of the semiconductor component (7) is thermally coupled to the cooling element (12) by means of the heat exchanger (14). The cooling element (12) and the power semiconductor of the semiconductor component (7) are electrically insulated from each other.