SEMICONDUCTOR DEVICE
There is provided a semiconductor device including: a substrate body configured to include a first surface and a second surface opposite to the first surface; a power semiconductor element configured to be mounted on the first surface; a cooler configured to be in contact with the second surface; an...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | There is provided a semiconductor device including: a substrate body configured to include a first surface and a second surface opposite to the first surface; a power semiconductor element configured to be mounted on the first surface; a cooler configured to be in contact with the second surface; and a temperature sensor configured to measure the temperature of the power semiconductor element, in which the temperature sensor is provided on a first side which is a side on which the power semiconductor element is mounted with respect to the substrate body, and is provided at a position farther away from the first surface of the substrate body than the power semiconductor element. |
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