SEMICONDUCTOR DEVICE

There is provided a semiconductor device including: a substrate body configured to include a first surface and a second surface opposite to the first surface; a power semiconductor element configured to be mounted on the first surface; a cooler configured to be in contact with the second surface; an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: EZUMI, Masahiko
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:There is provided a semiconductor device including: a substrate body configured to include a first surface and a second surface opposite to the first surface; a power semiconductor element configured to be mounted on the first surface; a cooler configured to be in contact with the second surface; and a temperature sensor configured to measure the temperature of the power semiconductor element, in which the temperature sensor is provided on a first side which is a side on which the power semiconductor element is mounted with respect to the substrate body, and is provided at a position farther away from the first surface of the substrate body than the power semiconductor element.