WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BODY, AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE

A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the subst...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NIRENGI, Takayoshi, TOJO, Tadashi, OISHI, Akihiro, AISAKA, Tsutomu, MATSUSHITA, Daisuke, IWANAGA, Jumpei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A wiring body (30) disposed above a substrate (10) including a conductor (11) includes: a via electrode (31) provided in a via hole (21) formed in an insulating layer (20) above the substrate (10) and connected to the conductor (11) through the via hole (21); and wiring (32) provided above the substrate (10) with the insulating layer (20) interposed therebetween. The material or structure of a lower layer in the via electrode (31) and the material or structure of a lower layer in the wiring (32) are different.