FLUX FOR FLUX-COATED SOLDER PREFORM, FLUX-COATED SOLDER PREFORM, AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS ON ELECTRONIC SUBSTRATE

An objective of the present invention is to provide a flux for flux-coated solder preform, a flux-coated solder preform, and a method for mounting an electronic component on an electronic substrate using the flux-coated solder preform, having good workability in drawing out a flux-coated solder pref...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIRAOKA, Miyuki, MURAOKA, Manabu, KIMURA, Nobuhito
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An objective of the present invention is to provide a flux for flux-coated solder preform, a flux-coated solder preform, and a method for mounting an electronic component on an electronic substrate using the flux-coated solder preform, having good workability in drawing out a flux-coated solder preform from a reel, being free from misalignment of an electronic component during reflow soldering,. The flux for flux-coated solder preform has a softening point of 80 to 120°C.