METHOD FOR MANUFACTURING POLYIMIDE-BASED FILM

The present invention relates to a polyimide-based film, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

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Bibliographische Detailangaben
Hauptverfasser: JUNG, Hak-Gee, HONG, Ki ll
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to a polyimide-based film, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.