LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME

Laser processing head (10) includes housing (11) and a plurality of optical components. Housing (11) includes first and second light entrance ports (12a) and (12b) through which first and second laser beams (A) and (B) are incident, and light irradiation port (13). Second laser beam (B) has a wavele...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI, Wataru, OGUCHI Hisayuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Laser processing head (10) includes housing (11) and a plurality of optical components. Housing (11) includes first and second light entrance ports (12a) and (12b) through which first and second laser beams (A) and (B) are incident, and light irradiation port (13). Second laser beam (B) has a wavelength different from first laser beam (A). The plurality of optical components include bend mirror (30), dichroic mirror (40), aperture (71), and detection-side condensing lens (70). First and second laser beams (A) and (B) transmitted through detection-side condensing lens (70) are received by image sensor (60). Aperture (71) is configured to be able to reduce diameters of first and second laser beams (A) and (B) incident on detection-side condensing lens (70).