HEAT SINK FOR ELECTRONIC COMPONENT AND ASSOCIATED MANUFACTURING METHOD

A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MENN, Thibaut, BONVALLANT, Guillaume, VIVET, Laurent, LEON, Renau, BISSON, Jean-Francois, BAPTISTE, Decrouy
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY RESISTORS SEMICONDUCTOR DEVICES
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