HEAT SINK FOR ELECTRONIC COMPONENT AND ASSOCIATED MANUFACTURING METHOD

HEAT SINK FOR ELECTRONIC COMPONENT AND ASSOCIATED MANUFACTURING METHOD

A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is...

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Bibliographische Detailangaben
Hauptverfasser: MENN, Thibaut, BONVALLANT, Guillaume, VIVET, Laurent, LEON, Renau, BISSON, Jean-Francois, BAPTISTE, Decrouy
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
RESISTORS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.