WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR

WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR

A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ko, Byung Hoon, Park, Sang Yun, Noh, Seung Woo, Kim, Youn Ho, Choi, Jin Woo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.