LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE

A laminate contains: a semiconductor substrate; a light-transmissive support substrate; and an adhesive layer and a release layer that are provided between the semiconductor substrate and the support substrate, in which the release layer absorbs light emitted from a side of the support substrate and...

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Bibliographische Detailangaben
Hauptverfasser: MORIYA Shunsuke, OKUNO Takahisa
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A laminate contains: a semiconductor substrate; a light-transmissive support substrate; and an adhesive layer and a release layer that are provided between the semiconductor substrate and the support substrate, in which the release layer absorbs light emitted from a side of the support substrate and then is used for release the semiconductor substrate and the support substrate, the release layer is a layer formed of a release agent composition, and the release agent composition contains a compound having: a first structure that is a structure for absorbing the light, contributes to easy release of the semiconductor substrate and the support substrate by absorbing the light, and has two or more aromatic rings constituting a π-electron conjugated system; and a siloxane structure as a second structure.