POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE OBTAINED BY MOLDING SAME

The present invention pertains to a polyamide resin composition which contains, with respect to 100 parts by mass of a polyamide resin (A), 0.1-100 parts by mass of a thermoplastic resin (B) having a reactive functional group and 0.1-5 parts by mass of an organically modified siloxane compound (C) h...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIDA Shingo, AKITA Masaru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention pertains to a polyamide resin composition which contains, with respect to 100 parts by mass of a polyamide resin (A), 0.1-100 parts by mass of a thermoplastic resin (B) having a reactive functional group and 0.1-5 parts by mass of an organically modified siloxane compound (C) having a specific structure.