POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE

Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130°C) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid o...

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Hauptverfasser: MAKIGUCHI, Wataru, WASHIO, Isao, DOI, Haruka, NISHINO, Kohei
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130°C) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid or alicyclic dicarboxylic acid and a component unit (b2) deriving from 1,3-bis(aminomethyl)cyclohexane. The polyamide resin composition further comprises at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) comprising a prescribed phosphinate salt compound or bisphosphinate salt compound or a polymer thereof.