SYSTEMS AND METHODS FOR TREATING A SUBSTRATE

Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series meta...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAR, Kuldeep, HARRIS, Rachel Dory, BROWN-TSENG, Elizabeth Stephenie, MCMILLEN, Mark William
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Disclosed herein is a composition comprising a first lanthanide series metal, wherein the composition has a pH of less than 2.0 and is substantially free of peroxide. Also disclosed herein is a composition comprising a first lanthanide series metal and at least one of a second lanthanide series metal, copper, an inorganic phosphate compound, an organophosphate compound, and an organophosphonate compound; wherein the composition is substantially free of peroxide. Also disclosed herein are systems and methods of treating a metal substrate. Also disclosed are substrates treated with the systems and methods.