APPARATUS AND METHOD FOR MANUFACTURING ASSEMBLY HAVING MULTIPLE SEPARATED CONDUCTORS EMBEDDED WITHIN A SUBSTRATE

An apparatus (200) includes an extruding device (202) configured to selectively dispense a dielectric material through an orifice (206), a wire feed device (208) configured to selectively feed a conductive wire (102) through the orifice (206), a cutting device (210) configured to selectively sever t...

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Bibliographische Detailangaben
Hauptverfasser:	PETERSON, David R, MCGARVEY, Shae T, RHINEHART JR., Gerald A, BILAS, Jared
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS INSULATORS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS REGULATING SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An apparatus (200) includes an extruding device (202) configured to selectively dispense a dielectric material through an orifice (206), a wire feed device (208) configured to selectively feed a conductive wire (102) through the orifice (206), a cutting device (210) configured to selectively sever the conductive wire (102) after it is fed through the orifice (206), and an electronic controller (214) configured to control the extruding device (202), the wire feed device (208), and the cutting device (210). The electronic controller (214) commands the extruding device (202) to selectively dispense the dielectric material through the orifice (206), the wire feed device (208) to selectively feed the conductive wire (102) through the orifice (206), and the cutting device (210) to selectively sever the conductive wire (102), thereby forming a dielectric substrate (104) encasing a plurality of conductive wires (102). The electronic controller (214) further commands the extruding device (202) to form an opening defined in the substrate (104) in which the plurality of electrically conductive wires (102) is exposed and a fiducial mark (108) that can be used by an automated assembly robot to determine the location of the opening, wherein a position tolerance of the opening relative to the fiducial mark (108) is 1 millimeter or less.