METHOD FOR BONDING PARTS WITH REDUCED READ-THROUGH DEFORMATION
Disclosed is a method for bonding two substrates comprising the sequential steps of- i) applying a pumpable thermally foaming filler composition on a first substrate S1, and- ii) placing the second substrate S2 so that the distance between the first substrate S1 and the second substrate S2 at the pl...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Disclosed is a method for bonding two substrates comprising the sequential steps of- i) applying a pumpable thermally foaming filler composition on a first substrate S1, and- ii) placing the second substrate S2 so that the distance between the first substrate S1 and the second substrate S2 at the place of application of the pumpable thermally foaming filler composition is between 2 - 10 mm, and- iii) heating the first substrate S1 and the second substrate S2 to a temperature above the activation temperature of the foaming agent to foam the pumpable thermally foaming filler composition, wherein between step ii) and step iii) the applied pumpable thermally foaming filler composition is not in contact with the second substrate S2.The pumpable thermally foaming filler composition comprises at least one rubber, a polyvinylchloride resin and/or acrylic resin powder and a foaming agent. The method of bonding substrates with a thermally expandable composition provides a reduced bond line read through (BLRT) phenomenon. |
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