METHOD OF MANUFACTURING A SEMICONDUCTOR ASSEMBLY HAVING SEMICONDUCTOR ELEMENT AND SUBSTRATE

The invention relates to a method for producing a semiconductor assembly (2) comprising a semiconductor element (4) and a substrate (12). In order to improve the reliability of the semiconductor assembly (2), the following steps are proposed: bonding (A) a first power contact (6) of the semiconducto...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Schmenger, Jens
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a method for producing a semiconductor assembly (2) comprising a semiconductor element (4) and a substrate (12). In order to improve the reliability of the semiconductor assembly (2), the following steps are proposed: bonding (A) a first power contact (6) of the semiconductor element (4) to a first metallization (10) of the substrate (12) and a second power contact (8) of the semiconductor element (4), said second power contact being arranged on the semiconductor element (4) face facing away from substrate (12), to a molded metal body (20), contacting (B) a metal contacting element (22) to the second power contact (8) via the molded metal body (20), and pressing (C) the metal contacting element (22) against the semiconductor element (4) via a dielectric pressing element (26), wherein a force (F) acting perpendicularly on the semiconductor element (4) is transferred via the dielectric pressing element (26).