METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD

The method for manufacturing a circuit board according to the present invention comprises a step for placing, on a semi-cured composite sheet (10), a plate-shaped member (30) having openings (31); a step for fitting cut metal foil products (20) into the openings (31) of the plate-shaped member (30) and placing the cut metal foil products (20) on the semi-cured composite sheet (10) on which the plate-shaped member (30) is placed; a step for pressurizing the semi-cured composite sheet (10) on which the plate-shaped member (30) and the cut metal foil products (20) are placed while heating the same to produce a first laminated body; and a step for removing the plate-shaped member (30) from the first laminated body to produce a second laminated body. The absolute value of the difference between the thickness of the cut metal foil products (20) and the thickness of the plate-shaped member (30) is 0.25 mm or less, and the dielectric breakdown voltage is 3.5 kV or more. The present invention can provide a method for manufacturing a circuit board capable of suppressing occurrence of cracks in a semi-cured composite sheet that includes a porous ceramic and a semi-cured product of a thermosetting composition filling gaps of the porous ceramic even when cut metal foil products obtained by cutting metal foil is attached to the semi-cured composite sheet and pressure is applied thereto.