DEVICE FOR DETECTING DEFECT IN WIRE BONDING AND OPERATION METHOD THEREOF

An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect u...

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Bibliographische Detailangaben
1. Verfasser:	CHOI, Jee Hoon
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING CLADDING OR PLATING BY SOLDERING OR WELDING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect ultrasonic bonding parameters continuously during the ultrasonic wire bonding process, machine learning training may be performed by a convolutional neural network, and a bonding defect may be detected based thereon.