OPEN-CAVITY PACKAGE FOR CHIP SENSOR

In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUEDERS, Michael, MUELLNER, Ernst Georg
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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