OPEN-CAVITY PACKAGE FOR CHIP SENSOR

In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LUEDERS, Michael, MUELLNER, Ernst Georg
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is over-molded with mold compound only on one side of the interconnect substrate so that the aperture remains free of mold compound to allow the on-chip element to have access to the environment.