CIRCUIT BOARD AND MANUFACTURING METHOD

Provided are a circuit board and a manufacturing method, capable of further improving heat dissipation of a semiconductor chip such as a semiconductor chip mounted on an additional metal layer using solder, the additional metal layer bonded to a circuit pattern diverting an ultrasonic bonding techni...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, Kohei, YAMAUCHI, Yuichiro, TANAKA, Ryo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a circuit board and a manufacturing method, capable of further improving heat dissipation of a semiconductor chip such as a semiconductor chip mounted on an additional metal layer using solder, the additional metal layer bonded to a circuit pattern diverting an ultrasonic bonding technique. The circuit board having a circuit pattern 3 on a base plate 5 and an additional metal layer 9 laid and bonded on the circuit pattern 3, wherein the additional metal layer 9 comprises an attachment plane portion 13 configured to fix a semiconductor chip 11 using solder, and an engagement uneven portion 17 provided adjacent to the attachment plane portion 13 to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer 9 on the circuit pattern 3 with ultrasonic vibration, wherein the attachment plane portion 13 is a face having unevenness smaller than the engagement uneven portion 17.