FILM-LAMINATED METAL SHEET, METHOD FOR MANUFACTURING SAME, SUBSTRATE FOR FLEXIBLE ELECTRONICS, AND ORGANIC EL SUBSTRATE

Provided are a film-laminated metal sheet which satisfies smoothness, heat resistance, flexibility, and gas barrier properties and has a low environmental burden and excellent productivity and a method for producing the metal sheet, a substrate for flexible electronics, and an organic EL substrate.T...

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Bibliographische Detailangaben
Hauptverfasser:	FUJIMOTO, Soichi, OSHIMA, Yasuhide
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a film-laminated metal sheet which satisfies smoothness, heat resistance, flexibility, and gas barrier properties and has a low environmental burden and excellent productivity and a method for producing the metal sheet, a substrate for flexible electronics, and an organic EL substrate.The film-laminated metal sheet has at least one surface covered with a resin film. The arithmetic average roughness Sa of a surface of the resin film is 0.030 pm or less. The maximum peak height Sp of the surface of the resin film is 0.30 um or less. The maximum valley depth Sv of the surface of the resin film is 1.0 um or less.