CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRATED CIRCUITS

CHIP SCALE QFN PLASTIC PACKAGING SYSTEM FOR HIGH FREQUENCY INTEGRATED CIRCUITS

The invention relates to a Chip-Scale QFN (Chip Scale QFN, CSQFN) plastic packaging system (1) for high frequency integrated circuits with high electrical and thermal performance, that does not use connecting wires, which are inexpensive and reliable, whose connection to PCB can be reprocessed and t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DEGIRMENCI, AHMET, AKTUG, AHMET, AYDOGAN, YIGIT
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a Chip-Scale QFN (Chip Scale QFN, CSQFN) plastic packaging system (1) for high frequency integrated circuits with high electrical and thermal performance, that does not use connecting wires, which are inexpensive and reliable, whose connection to PCB can be reprocessed and that are compatible with standard SMD bonding processes on PCB.